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UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
Rev. 04 -- 30 May 2006 Product data sheet
1. General description
The UDA1431T is a 16-bit, 48 kHz, single-chip stereo DAC employing bitstream conversion techniques. The UDA1431T supports the I2S-bus data format with word lengths of up to 24 bits, MSB justified and can be operated with a 256fs master clock mode. The audio outputs meet the IEC 61938 specification.
2. Features
I I I I I I I I I I I I Low power consumption Analog power supply voltage from 10.8 V to 13.2 V Digital power supply voltage from 3.1 V to 3.5 V Master clock frequencies of 256fs Supports sampling frequencies up to 48 kHz Integrated digital filter No analog post filtering required for DAC Slave mode only applications I2S-bus input interface: 16-bit, 18-bit, 20-bit and 24-bit format compatible CMOS levels compatible digital inputs and outputs Very easy application Advanced audio configuration: N Stereo line output N High linearity, wide dynamic range and low distortion I Small package size (SO14)
3. Applications
I I I I PC audio applications Car radio applications DVD players Digital set-top boxes
Philips Semiconductors
UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
4. Quick reference data
Table 1. Quick reference data VDDA = 12.0 V; VDDD = 3.3 V; Tamb = 25 C; fs = 48 kHz; fi = 1 kHz; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified. Symbol Supplies VDDA VDDD IDDA analog supply voltage (for DAC) digital supply voltage analog supply current (for DAC) VDDA = 12.0 V operating power-down IDDD digital supply current VDDD = 3.3 V operating power-down Ptot Tamb Vo(rms) (THD + N)/S total power dissipation ambient temperature output voltage (RMS value) total harmonic distortion-plus-noise to signal ratio signal-to-noise ratio channel separation at 0 dB; from 1 kHz to 20 kHz at 0 dB at -60 dB
[2][3] [2][4] [3][5] [1] [1]
Parameter
Conditions
Min 10.8 3.1 [1]
Typ 12.0 3.3 6.6 0.8 7.0 6.8 102 1.880 -66 -32.5 94 98
Max 13.2 3.5 65 1.925 -
Unit V V mA mA mA mA mW C V dB dB dB dB
operating
5 1.575 -62 89 85
Digital-to-analog converter
S/N cs
[1] [2] [3] [4] [5]
A 1 kHz at 0 dB sine wave input is applied. (THD + N)/S is the power ratio between the sum of noise and distortion and the output signal. Measurement is performed with a 22 kHz low-pass filter and is unweighted. Measurement is performed with a ITU-R-2K filter and is unweighted. S/N is the power ratio between the output signal and the noise measured with no signal applied.
5. Ordering information
Table 2. Type number UDA1431T Ordering information Package Name SO14 Description plastic small outline package; 14 leads; body width 3.9 mm Version SOT108-1
UDA1431T_4
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Philips Semiconductors
UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
6. Block diagram
VDDD DVREF AVREF 11 8 VDDA 9 PD_N 12
UDA1431T
13 4 2 3 I2S-BUS INTERFACE
14
MCLK BCLK WS SDI
UPSAMPLING FILTERING NOISE SHAPING
CURRENT DAC
AMPLIFIER
6
ROUT
UPSAMPLING FILTERING NOISE SHAPING DIGITAL 1 VSSD
CURRENT DAC ANALOG 7 VSSA
AMPLIFIER
10
LOUT
001aac962
Fig 1. Block diagram
7. Pinning information
7.1 Pinning
VSSD WS SDI BCLK i.c. ROUT VSSA
1 2 3 4 5 6 7
001aac963
14 VDDD 13 MCLK 12 PD_N
UDA1431T
11 DVREF 10 LOUT 9 8 VDDA AVREF
Fig 2. Pin configuration
7.2 Pin description
Table 3. Symbol VSSD WS SDI BCLK i.c. Pin description Pin 1 2 3 4 5 Description digital ground word select input serial audio data input bit clock input internally connected; do not connect or connect to VDDD
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Philips Semiconductors
UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
Pin description ...continued Pin 6 7 8 9 10 11 12 13 14 Description right channel output analog ground (for DAC) regulator decoupling analog supply voltage (for DAC) left channel output internal reference voltage (digital part) power-down input (active LOW) master clock input (256fs) digital supply voltage
Table 3. Symbol ROUT VSSA AVREF VDDA LOUT DVREF PD_N MCLK VDDD
8. Functional description
8.1 Master clock
The UDA1431T operates in slave mode only. Therefore, in all applications the system devices must provide a master clock (pin MCLK) at 256fs for correct operation. The master clock must be locked in frequency to the digital interface input signals. The UDA1431T supports sampling frequencies up to 48 kHz.
8.2 Data formats
The I2S-bus formats are shown in Figure 3. Left and right data channel words are time multiplexed. The UDA1431T supports I2S-bus formats with data word length up to 24 bits. The BCLK clock can be up to 48fs, or in other words the BCLK frequency is 48 times or less the word select frequency (pin WS): fBCLK 48 x fWS. Important: The WS edge MUST fall on the negative edge of the BCLK at all times for proper operation of the digital interface.
8.3 Noise shaper
The 1st-order noise shaper operates at 32fs. It shifts in-band quantization noise to frequencies well above the audio band. This noise shaping technique enables high signal-to-noise ratios to be achieved. The noise shaper output is converted into an analog signal using a current DAC.
8.4 Reset
After turning on the power supplies of the device, the device must be reset. This is done by applying a logic 0 pulse on PD_N (pin 12) during at least 8 full MCLK periods. If PD_N (pin 12) has a value of logic 0 at start-up, it must be set to logic 1 only after 8 full MCLK periods. The device is ready to receive audio data only after 128 MCLK periods from the end of the reset.
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Product data sheet Rev. 04 -- 30 May 2006
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. UDA1431T_4
Philips Semiconductors
WS
LEFT CHANNEL
RIGHT CHANNEL
BCLK MSBR B2R B3R B14R B15R LSBR MSBL
SDI
MSBL
B2L
B3L
B14L
B15L
LSBL
I2S-BUS FORMAT
WS
LEFT CHANNEL
RIGHT CHANNEL
16-bit, 48 kHz, low-cost stereo current DAC
BCLK
SDI
LSBR
MSBL
B2L
B3L
B14L
B15L
LSBL
MSBR
B2R
B3R
B14R
B15R
LSBR
MSBL
001aac967
I2S-BUS FORMAT IN 16-BIT MODE
UDA1431T
5 of 17
Fig 3. I2S-bus data formats
Philips Semiconductors
UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
9. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDDA VDDD Txtal Tstg
[1]
Parameter analog supply voltage (for DAC) digital supply voltage crystal temperature storage temperature
Conditions
[1]
Min -65
Max 15.2 5.5 125 +125
Unit V V C C
[1]
All supply connections must be made to the same power supply.
10. Thermal characteristics
Table 5. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air Typ 115 Unit K/W
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UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
11. Static characteristics
Table 6. Static characteristics VDDA = 12.0 V; VDDD = 3.3 V; Tamb = 25 C; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified. Symbol Parameter Supplies VDDA VDDD IDDA analog supply voltage (for DAC) digital supply voltage analog supply current (for DAC) VDDA = 12.0 V operating power-down IDDD digital supply current VDDD = 3.3 V operating power-down Ptot Tamb VIL VIH |ILI| Ci VO(DC)
[1]
[1] [1]
Conditions
Min 10.8 3.1 [1]
Typ 12.0 3.3 6.6 0.8 7.0 6.8 102 4.9
Max 13.2 3.5 65
Unit V V mA mA mA mA mW C
total power dissipation ambient temperature LOW-level input voltage HIGH-level input voltage input leakage current (absolute value) input capacitance channel DC output voltage
operating
5 0 -
Digital inputs: pins BCLK, WS, SDI, PD_N and MCLK 0.3VDDD V VDDD 1 2.5 V A pF V 0.7VDDD -
Digital-to-analog converter with respect to pin VSSA -
A 1 kHz at 0 dB sine wave input is applied.
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Philips Semiconductors
UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
12. Dynamic characteristics
Table 7. Dynamic characteristics VDDA = 12.0 V; VDDD = 3.3 V; Tamb = 25 C; fs = 48 kHz; fi = 1 kHz; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified. Symbol Vo(rms) Vo (THD + N)/S Parameter output voltage (RMS value) unbalance between channels total harmonic distortion-plus-noise to signal ratio dynamic range signal-to-noise ratio pass-band gain at -20 dB; over the band 20 Hz to 20 kHz at -3 dB cut-off frequency at -20 dB; over the band 20 Hz to 20 kHz at 0 dB; from 1 kHz to 20 kHz at -20 dB on both channels at 0 dB at -60 dB at -60 dB
[1][2] [1][3] [3][4] [2][5]
Conditions
Min 1.575 -62 89 89 -1.0
Typ 1.880 -66 -32.5 92.5 94 -
Max 1.925 0.5 +0.5
Unit V dB dB dB dB dB dB
Digital-to-analog converter
DNR S/N Gpb
B mis
bandwidth phase mismatch
-
22 0.2
1.5
kHz deg
cs
[1] [2] [3] [4] [5]
channel separation
85
98
-
dB
(THD + N)/S is the power ratio between the sum of noise and distortion, and the output signal. Measurement is performed with a 22 kHz low-pass filter and is unweighted. Measurement is performed with a ITU-R-2K filter and is unweighted. DNR is the result of (THD + N)/S corrected with the full-scale ratio (60 dB in this case). S/N is the power ratio between the output signal and the noise measured with no signal applied.
Table 8. Timing characteristics VDDA = 12.0 V; VDDD = 3.3 V; Tamb = 5 C to 65 C; fs = 48 kHz; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified. Symbol td(po-so) Parameter delay time from power on to stable output Conditions MCLK active
[1]
Min -
Typ -
Max 500
Unit ms
Master clock (see Figure 4) Master clock input: pin MCLK Tcy(MCLK) tWL tWH master clock cycle time pulse width LOW pulse width HIGH 28 28 81.4 53 53 ns ns ns
Digital interface (see Figure 5) Bit clock input: pin BCLK Tcy(BCLK) tWL
UDA1431T_4
bit clock cycle time pulse width LOW
20.83 7.29
-
-
s s
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Philips Semiconductors
UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
Table 8. Timing characteristics ...continued VDDA = 12.0 V; VDDD = 3.3 V; Tamb = 5 C to 65 C; fs = 48 kHz; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified. Symbol tWH tr tf tsu(SDI) th(SDI) tsu(WS) th(WS)
[1]
Parameter pulse width HIGH rise time fall time data input set-up time data input hold time word select set-up time word select hold time
Conditions
Min 7.29 4.16 0 4.16 0
Typ -
Max 3.12 3.12 -
Unit s s s s s s s
Data input: pin SDI
Word select input: pin WS
The device is ready to receive audio data only after 128 MCLK periods from the end of the reset; see Section 8.4.
tWH MCLK tWL Tcy(MCLK)
001aac965
Fig 4. System clock timing
WS
tWH tr BCLK tf
th(WS) tsu(WS)
tWL Tcy(BCLK)
tsu(SDI) th(SDI)
SDI
001aac966
Fig 5. Serial interface timing
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UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
13. Application information
3.3 V
100 nF
12 V
100 nF
DGND VDDD BCLK audio data I2S-bus (3-wire) WS SDI 14 4 2 3 10 9 6 VDDA
AGND
ROUT
LOW-PASS FILTER (AC COUPLED)(1)
right channel
LOUT
LOW-PASS FILTER (AC COUPLED)(1)
left channel
UDA1431T
master clock fMCLK = 256fs (2) MCLK 13 8 AVREF
100 nF 4.7 F
connect to VDDD for normal use (2)
PD_N
12 7 VSSA AGND 1
11
DVREF
AGND
100 nF 4.7 F
VSSD AGND DGND
001aac964
(1) At low frequencies, optimum performances will be reached using a Tantalum or a Niobium capacitor rather than with a ceramic capacitor. (2) After turning on the power supplies of the device, the device must be reset. This is done by applying a logic 0 pulse on PD_N (pin 12) during at least 8 full MCLK periods; see Section 8.4.
Fig 6. Application diagram
14. Test information
14.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
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UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
15. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 pin 1 index Lp 1 e bp 7 wM L detail X A1 (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 inches 0.069 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
0.028 0.004 0.012
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 7. Package outline SOT108-1 (SO14)
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UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
16. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe you must take normal precautions appropriate to handling integrated circuits.
17. Soldering
17.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow temperatures range from 215 C to 260 C depending on solder paste material. The peak top-surface temperature of the packages should be kept below:
Table 9. SnPb eutectic process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 240 C + 0/-5 C 225 C + 0/-5 C Volume mm3 350 225 C + 0/-5 C 225 C + 0/-5 C
Package thickness < 2.5 mm 2.5 mm Table 10.
Pb-free process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 260 C + 0 C 260 C + 0 C 250 C + 0 C Volume mm3 350 to 2000 260 C + 0 C 250 C + 0 C 245 C + 0 C Volume mm3 > 2000 260 C + 0 C 245 C + 0 C 245 C + 0 C
Package thickness < 1.6 mm 1.6 mm to 2.5 mm 2.5 mm
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.
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UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
17.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
17.5 Package related soldering information
Table 11. Package[1] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[8],
UDA1431T_4
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable[4] Reflow[2] suitable suitable
suitable not recommended[5][6] not recommended[7] WQCCN..L[8] not suitable
suitable suitable suitable not suitable
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PMFP[9],
Product data sheet
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UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
[1] [2]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[3]
[4]
[5] [6] [7] [8]
[9]
UDA1431T_4
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16-bit, 48 kHz, low-cost stereo current DAC
18. Revision history
Table 12. Revision history Release date 20060530 Data sheet status Product data sheet Change notice Supersedes UDA1431T_3 Document ID UDA1431T_4 Modifications: UDA1431T_3 UDA1431T_2 UDA1431T_1 (9397 750 14957)
* *
Added: Section 8.4 "Reset" Changed: table note 2 of Table 8 and figure note 2 of Figure 6 Product data sheet Product data sheet Product data sheet UDA1431T_2 UDA1431T_1 (9397 750 14957) -
20060329 20060220 20060206
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19. Legal information
19.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.
19.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
19.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
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16-bit, 48 kHz, low-cost stereo current DAC
21. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 9 10 11 12 13 14 14.1 15 16 17 17.1 17.2 17.3 17.4 17.5 18 19 19.1 19.2 19.3 19.4 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Master clock . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Data formats . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Noise shaper. . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . 10 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 Quality information . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Handling information. . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 30 May 2006 Document identifier: UDA1431T_4

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